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Place of Origin : China
MOQ : Negotiable
Price : Negotiable
Payment Terms : T/T
Supply Ability : 100000pc/Month
Delivery Time : 4 Weeks
Packaging Details : PCB + Box
Brand Name : CUSTOM MADE
Certification : ISO/UL
Keyword : One Stop PCB Assembly
Applications : Automotive Electronics, Communication
Special Capability : Peelable, Carbon ink
PCB boards : Rigid-Flex Board, Metal Substrate Boards, Multi-Layer Boards
Min PP Thickness : 0.06mm
Materials : Nelco,RCC,PTFE, M4, M6,TU862,TU872
HDI : 1+n+1,2+n+2,3+n+3
Payment Method : T/T
Whether to Support customization : Support
Logistics : Accept customer specified logistics
Gold Finger Plating One Stop PCB Assembly Testability Rigid - Flex Boards HASL
One-Stop PCB Assembly Description:
1. Quick-turn and flexible delivery
 2. Support a wide range of PCBs: high-layer, multi-layer, rigid-flex, high frequency, high speed, etc.
 3. Professional supplier positioning.
 4. Seamless link from prototype to mass production.
 5. Whole-flow quality assurance, IPC, Special industry inspection standard.
 One-Stop PCB Assembly Parameters:
| SMT Capability | 14 million spots per day | 
| SMT Lines | 12 SMT lines | 
| Reject Rate | R&C: 0.3% | 
| IC: 0% | |
| PCB Board | POP boards/Normal Boards/FPC boards/Rigid-flex boards/Metal base boards | 
| Parts Dimension | Min BGA Footprint:03015 Chip/0.35mm BGA | 
| Parts SMT Accuracy:±0.04mm | |
| IC SMT Accuracy:±0.03mm | |
| PCB Dimension | Size:50*50mm-686*508mm | 
| Thickness: 0.3-6.5mm | 
 One-Stop PCB Assembly Introduction:
The earliest use of printed circuit boards is paper-based copper-clad printed boards. Since the advent of semiconductor transistors in the 1950s, the demand for printed boards has risen sharply. Especially with the rapid development and wide application of integrated circuits, the volume of electronic equipment is getting smaller and smaller, and the circuit wiring density and difficulty are getting bigger and bigger, which requires the printed board to be updated continuously. At present, the variety of printed boards has developed from single-sided to double-sided, multi-layer boards and flexible boards; the structure and quality have also developed to ultra-high density, miniaturization, and high reliability.

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